Improvement in Step Coverage at Submicron Contact Holes by Switching Bias Sputtering
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چکیده
منابع مشابه
Modeling and Optimization of the Step Coverage of Tungsten LPCVD in Trenches and Contact Holes
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ژورنال
عنوان ژورنال: Materials Transactions, JIM
سال: 1995
ISSN: 0916-1821,2432-471X
DOI: 10.2320/matertrans1989.36.670